A study on release agent for die-casting according to mold temperature

A study on release agent for die-casting according to mold temperature講演概要・記念講演[M]200910A study on release agent for die-casting according to mold temperatureA study on release agent for die-casting according to mold temperatureC.W.Lee(韓国生産技術研究院[Korea Institute of Industrial Technology](KITECH))、J.H.Yoo(韓国生産技術研究院[Korea Institute of Industrial Technology](KITECH))、K.M.Lim(韓国生産技術研究院[Korea Institute of Industrial Technology](KITECH))、E.S.Kim(韓国生産技術研究院[Korea Institute of Industrial Technology](KITECH))、Y.H.Park(韓国国立釜山大学校[Pusan National University])A study on release agent for die-casting according to mold temperature155-0151講演概要・記念講演[M]n19357

分類講演概要・記念講演[M]
DOI
掲載年月200910
論文名A study on release agent for die-casting according to mold temperature
論文名(英)A study on release agent for die-casting according to mold temperature
研究者C.W.Lee(韓国生産技術研究院[Korea Institute of Industrial Technology](KITECH))、J.H.Yoo(韓国生産技術研究院[Korea Institute of Industrial Technology](KITECH))、K.M.Lim(韓国生産技術研究院[Korea Institute of Industrial Technology](KITECH))、E.S.Kim(韓国生産技術研究院[Korea Institute of Industrial Technology](KITECH))、Y.H.Park(韓国国立釜山大学校[Pusan National University])
キーワードA study on release agent for die-casting according to mold temperature
掲載ページ155-0151
IDn19357