A study on release agent for die-casting according to mold temperature
A study on release agent for die-casting according to mold temperature講演概要・記念講演[M]200910A study on release agent for die-casting according to mold temperatureA study on release agent for die-casting according to mold temperatureC.W.Lee(韓国生産技術研究院[Korea Institute of Industrial Technology](KITECH))、J.H.Yoo(韓国生産技術研究院[Korea Institute of Industrial Technology](KITECH))、K.M.Lim(韓国生産技術研究院[Korea Institute of Industrial Technology](KITECH))、E.S.Kim(韓国生産技術研究院[Korea Institute of Industrial Technology](KITECH))、Y.H.Park(韓国国立釜山大学校[Pusan National University])A study on release agent for die-casting according to mold temperature155-0151講演概要・記念講演[M]n19357
| 分類 | 講演概要・記念講演[M] |
|---|---|
| DOI | |
| 掲載年月 | 200910 |
| 論文名 | A study on release agent for die-casting according to mold temperature |
| 論文名(英) | A study on release agent for die-casting according to mold temperature |
| 研究者 | C.W.Lee(韓国生産技術研究院[Korea Institute of Industrial Technology](KITECH))、J.H.Yoo(韓国生産技術研究院[Korea Institute of Industrial Technology](KITECH))、K.M.Lim(韓国生産技術研究院[Korea Institute of Industrial Technology](KITECH))、E.S.Kim(韓国生産技術研究院[Korea Institute of Industrial Technology](KITECH))、Y.H.Park(韓国国立釜山大学校[Pusan National University]) |
| キーワード | A study on release agent for die-casting according to mold temperature |
| 掲載ページ | 155-0151 |
| ID | n19357 |
